JPS63202521U - - Google Patents
Info
- Publication number
- JPS63202521U JPS63202521U JP9474387U JP9474387U JPS63202521U JP S63202521 U JPS63202521 U JP S63202521U JP 9474387 U JP9474387 U JP 9474387U JP 9474387 U JP9474387 U JP 9474387U JP S63202521 U JPS63202521 U JP S63202521U
- Authority
- JP
- Japan
- Prior art keywords
- fuel tank
- cooling fan
- aircraft
- radiator cooling
- control unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002828 fuel tank Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
Landscapes
- Cooling, Air Intake And Gas Exhaust, And Fuel Tank Arrangements In Propulsion Units (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9474387U JPS63202521U (en]) | 1987-06-19 | 1987-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9474387U JPS63202521U (en]) | 1987-06-19 | 1987-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63202521U true JPS63202521U (en]) | 1988-12-27 |
Family
ID=30958521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9474387U Pending JPS63202521U (en]) | 1987-06-19 | 1987-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63202521U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
-
1987
- 1987-06-19 JP JP9474387U patent/JPS63202521U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
| US7238543B2 (en) | 2000-08-25 | 2007-07-03 | Micron Technology, Inc. | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties |